Over the past couple of years, we have written a great deal on the Converge blog about our electronic component testing and counterfeit detection capabilities. As an independent distributor, we are extremely proud of our rigorous 76-point inspection process and our ongoing commitment to quality control. We are proud of our industry certifications, our trained inspectors and component engineers, and our role in helping to define the quality standards that all independents should live by. More than anything else, we are proud of our record of keeping substandard electronic components out of the supply chain.
So how exactly do we do that? We have put together a short guide to Converge’s electronic component quality assurance services for your easy reference. These are the primary techniques that we use to ensure every order is exactly as it was represented to the customer. Some services are done as part of the 76-point inspection required for every single order; others, like decapsulation, are advanced testing techniques that are done only when parts need additional verification. Either way, Converge has invested in the necessary equipment so that our trained in-house experts can utilize these services whenever they are needed. If you would like to know more about any of the capabilities listed below, click through to read the original blog posts.
Baking Oven for Moisture-Sensitive Devices
- Converge follows the baking guidelines and procedures recommended by J-STD-033B
- Parts are baked in our calibrated ovens for the specified time and dry-packed immediately upon removal in a moisture-barrier antistatic bag
- Parts are also packed with a new humidity indicator card and the recommended amount of desiccant
- Used to verify RoHS compliance
- Verifies elemental breakdown of a scanned component’s content and detects substances of concern
- Nondestructive process
- Processor identification tool used to verify the authenticity of all incoming CPUs
- Tool verifies that the CPU type, family, model, stepping, revision, and frequency are consistent with the manufacturer’s specifications
- 2D data matrix bar code scanner enables inspectors to quickly capture serial numbers
- Designed to look inside components (e.g., ICs, capacitors, diodes, resistors, and hybrids) to help detect hidden flaws
- Can reveal differences in die size, die frame, wire bond patterns, and internal lead characteristics
- Can identify shorts or bridges, detect cracks in the epoxy, and recognize tampering attempts
- Nondestructive process
- Used to properly expose the die architecture of an integrated circuit for full visual inspection and further verification
- Verifies die size and manufacturer logo; confirms part numbers
- Destructive process; used as a last, but necessary, resort
What parts of the component quality assurance process would you like to know more about?
Contact us to let us know or leave us a comment below!